New Product Launch

RC600F08A2M8F_LN

Breaking the power limits of miniPACK packages

Recently, Anhui RedPower Microelectronics Co.,Ltd officially released the RC600F08A2M8F_LN automotive-grade power module. As a core product of the A2 (miniPACK) package series, this product is equipped with high power density IGBT chips and features a 750V voltage rating and a 600A rated current .
It can stably carry a continuous output current of 420 Arms under 10kHz high-frequency switching conditions . It achieves a comprehensive balance of power density, loss characteristics and reliability in a compact package, and is suitable for 120kW electric drive systems of range-extended, plug-in hybrid and pure electric passenger vehicles.

Key Indicators Overview

    Miniaturization -50%
    Compared to HPD, the package size is reduced by approximately 50%, contributing to system miniaturization and weight reduction.
    Low stray inductance 8.6nH
    The stray inductance of the main circuit is as low as 8.6nH, effectively suppressing switching voltage spikes.
    Low saturation voltage drop 1.30V@25℃
    Microgroove field termination process, typical saturation voltage drop as low as 1.30V @25℃/600A
    High-efficiency direct liquid cooling PinFin
    An elliptical PinFin liquid cooling base plate paired with a SiN AMB ceramic substrate offers low thermal resistance and high heat dissipation.
    High current carrying capacity 420 Arms
    Under continuous output, the junction temperature remains stable below 175°C, and the locked-rotor current is 538Adc.
    High reliability design with a junction temperature of 185℃
    Designed for automotive-grade applications, it has passed multiple reliability verifications.

Product Technical Analysis

    Dual improvement in power density and current carrying capacity
    The optimized chip layout, combined with the A2 package to compress the peripheral volume, effectively improves the current carrying capacity per unit area of the module .
    Continuous output : Under continuous output conditions of 420 Arms, the maximum junction temperature is still stably controlled within the rated threshold of 175℃.
    Stall current capability : Stall current can reach over 538Adc, covering the needs of high-load conditions such as vehicle acceleration and hill climbing.
    Co-optimization of conduction and switching losses
    Utilizing an optimized chip, the turn-off loss characteristics are superior to traditional solutions. Combined with micro-pattern trench/FS technology, a breakthrough is achieved in resolving the classic trade-off between on-state voltage drop and switching losses. Furthermore, the low stray inductance design of the A2 package further suppresses switching voltage spikes and reduces additional losses caused by parasitic parameters. This synergistic optimization effectively reduces the overall loss level across all operating conditions .
    Enhanced thermal management and reliability
    The optimized heat distribution design of the active area of the chip matches the efficient liquid cooling heat dissipation path of the A2 package: heat is no longer concentrated in local hot spots, but is evenly distributed on the chip surface and then quickly discharged through the PinFin base plate.
    This design ensures a balanced thermal distribution across the three-phase bridge arms of the module , and the junction temperature remains stable and controllable as it changes with current, keeping the chip junction temperature within the reasonable threshold range for automotive-grade devices.
    At the structural level, the internal interconnect structure of the module has been simplified and optimized , reducing the risk of interconnect failure. Under inverter conditions, the junction temperature fluctuation is the core factor determining the module's thermal fatigue life; through the thermal matching design of the chip and package, the junction temperature fluctuation at key locations is narrowed, effectively improving the overall service life of the module.
     Comprehensive cost optimization
    The miniaturized design of the A2 package, combined with the simplification and optimization of the internal structure and manufacturing process, reduces the number of internal assembly parts  and lowers the complexity of key processes such as bonding and soldering.
    It can help end customers achieve inverter solutions that are smaller, lighter, and more cost-effective , while also effectively reducing the overall manufacturing cost of the module itself.

Key parameters and application

Key parameters

application

    The release of the RC600F08 A2M8F_LN adds another 600A-class core product to the A2 package platform. From package miniaturization to heat dissipation system, from low stray design to loss optimization, from thermal management to reliability enhancement,  multiple dimensions work together to achieve a balance between power density and reliability in a compact A2 package .
    In the future, Redi Microelectronics will continue to advance the iteration of power semiconductor technology, expand its product matrix around the needs of automotive applications, and provide more competitive power semiconductor solutions for electric drive systems of new energy vehicles.

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